The purpose of this test is to simulate corrosion phenomenon due to atmospheric exposure.
Mixed Flowing Gas (MFG) test is a laboratory test in which the temperature (°C), relative humidity (%RH), concentration of gaseous pollutants (in parts per billion, ppb or parts per million ppm level), and other critical variables (such as volume exchange rate and airflow rate) are carefully defined, monitored and controlled.
The electronic product is exposed to gases such as chlorine, hydrogen sulfide, sulfide, nitrogen dioxide and sulfur dioxide at levels in the ppb range, in a controlled environmental chamber. Test samples that have been exposed to MFG testing have ranged from bare metal surfaces, to electrical connectors, and to complete assemblies. In regards to noble metal plated connector applications, MFG testing has been widely accepted as a qualification test method to evaluate the performance of these connectors. With regard to electrical and electronic applications, MFG testing has been widely accepted as a qualification test method to evaluate performance in the presence of environmental pollutants. The MFG exposures are generally used in conjunction with procedures which evaluate contact or connector electrical performance, such as measurement of electrical contact resistance before and after MFG exposure.
With regard to noble metal plated connector applications, MFG testing has been widely accepted as a qualification test method for evaluating the performance of connectors.